Custom Mold Fabrication​

Custom Mold Fabrication

We provide not only nanoimprinting but also injection molding and other types of mold for various types of fine molding.

We provide a wide range of services from small molds for R&D to large molds for mass production to meet your needs.

Standard Specification Molds​

We offer low-cost Si substrate molds made with the most advanced semiconductor processes.

You can choose from a lineup of mold sizes from 10 mm square to 300 mm diameter.

L & S

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L&S
Commodity CodeDimension of Structure Effective AreaStamp DimensionMaterialArray
MALS250/500/500-30×30Width:250nm, Height:500nm, Pitch:500nm□30mm□40mmSilicon(Si)
NALS250/500/500-30X30 Width:250nm, Height:500nm, Pitch:500nm□30mm□40mmNickel(Ni)
MTLS1/1/2-50×50Width:1μm, Height:1μm, Pitch:2μm□50mm□50mmSilicon(Si)
MTLS1/2/2-50×50Width:1μm, Height:2μm, Pitch:2μm□50mm□50mmSilicon(Si)
MALS5/1/10-30×30Width:5μm, Height:1μm, Pitch:10μm□30mm□40mmSilicon(Si)
NALS5/1/10-30×30Width:5μm, Height:1μm, Pitch:10μm□30mm□40mmNickel(Ni)
NALS500/250/1000-20×20 Width:500nm, Height:250nm, Pitch:1000nm□20mm□30mmNickel(Ni)

Pillar

Pillar

φ230nm

Pillar

Height200nm

Pitch460nm

Commodity CodeDimension of Structure Effective AreaStamp DimensionMaterialArray
NAP100/100/400-30X30φ100nm, Height:100nm, Pitch:400nm□30mm□40mmNickel(Ni) Square
MLP230/500/460-φ120φ230nm, Height:500nm, Pitch:460nmφ120mmφ120mmSilicon(Si)Hexagonal
NAP230/100/460-30X30φ230nm, Height:100nm, Pitch:460nm □30mm□40mmNickel(Ni)Hexagonal
NAP230/200/340-30X30φ230nmnm, Height:200nm, Pitch:340nm□30mm□40mmNickel(Ni)Hexagonal
NAP230/200/460-30X30φ230nm, Height:200nm, Pitch:460nm□30mm□40mmNickel(Ni)Square
MLP230/200/460-φ120φ230nm, Height:200nm, Pitch:460nmφ120mmφ120mmSilicon(Si)Hexagonal
NAP230/200/690-30X30φ230nmnm, Height:200nm, Pitch:690nm□30mm□40mmNickel(Ni)Hexagonal
NAP230/200/690-30X30φ230nmnm, Height:200nm, Pitch:690nm□30mm□40mmNickel(Ni)Square
NAP250/500/500-30×30φ250nm, Height:500nm, Pitch:500nm□30mm□40mmNickel(Ni) Hexagonal
NAP250/250/1000-20×20φ250nm, Height:250nm, Pitch:1000nm□20mm□30mmNickel(Ni) Square
NAP270/200/530-30X30φ270nm, Height:200nm, Pitch:530nm□30mm□40mmNickel(Ni)Hexagonal
NAP300/300/600-20×20 φ300nm, Height:300nm, Pitch:600nm□20mm□25mmNickel(Ni)Hexagonal
NAP300/600/600-30X30φ300nm, Height:600nm, Pitch:600nm□20mm□25mmNickel(Ni)Hexagonal
NAP300/600/800-30X30φ300nm, Height:600nm, Pitch:800nm□20mm□25mmNickel(Ni) Square
NAP310/200/620-30X30φ310nm, Height:200nm, Pitch:620nm□30mm□40mmNickel(Ni) Hexagonal
NAP400/200/600-30X30φ400nm, Height:200nm, Pitch:600nm □30mm□40mmNickel(Ni)Hexagonal
NAP400/200/600-30X30φ400nm, Height:200nm, Pitch:600nm□30mm□40mmNickel(Ni) Square
NAP400/400/600-30X30φ400nm, Height:400nm, Pitch:600nm □30mm□40mmNickel(Ni) Square
NAP500/250/1000-20×20φ500nm, Height:250nm, Pitch:1000nm□20mm□30mmNickel(Ni)Square
NAP600/400/800-30X30φ600nm, Height:400nm, Pitch:800nm□30mm□40mmNickel(Ni)Hexagonal
NAP600/400/800-30X30φ600nm, Height:400nm, Pitch:800nm□30mm□40mmNickel(Ni)Square
NAP2000/500/5000-30X30φ2000nm, Height:500nm, Pitch:5000nm□30mm□40mmNickel(Ni)Square

Hole

Hole

φ500nm

Hole

Depth500nm

Pitch4000nm

Commodity CodeDimension of Structure Effective Area Stamp Dimension MaterialArray
MAH100/100/400-30X30φ100nm, Depth:100nm, Pitch:400nm□30mm□40mm Silicon(Si)Square
MAH250/500/500-30×30φ250nm, Depth:500nm, Pitch:500nm□30mm□40mm Silicon(Si)Hexagonal
MLH230/200/460-φ120φ230nm, Depth:200nm, Pitch:460nm φ120mm φ120mmSilicon(Si)Hexagonal
MAH300/300/600-30X30φ300nm, Depth:300nm, Pitch:600nm□20mm □25mmSilicon(Si)Hexagonal
MAH300/600/600-30X30φ300nm, Depth:600nm, Pitch:600nm □20mm □25mmSilicon(Si)Hexagonal
MAH300/600/800-30X30φ300nm, Depth:600nm, Pitch:800nm □□20mm □25mmSilicon(Si)Square
MTH500/500/1000φ500nm, Depth:500nm, Pitch:1000nm □50mm□50mmSilicon(Si)Hexagonal
NAH2000/500/5000-30X30φ2000nm, Depth:500nm, Pitch:5000nm□30mm□40mm Nickel(Ni)Square
MTH1.9/2.3/3-50×50φ1.9μm, Depth3.3μm, Pitch3.0μm □50mm□50mmSilicon(Si)Hexagonal

Custom Mold​

We offer a variety of molds that can be manufactured according to our customer’s requirements.

We can fabricate molds in Si, Ni(NiP), SUS and quartz, using seven different methods to cover all sizes required for micro machining.

We also manufacture molds using the latest semiconductor technologies such as EB writing, laser writing, and high-speed writing, as well as injection molding technology (machining).

Pattern●Pillar ●Hole ●L&S ●Honeycomb ●Square ●Lens Array ●Blazed ●Retroreflector
Feature SizeSeveral tens of nm ~ Several μm
(a few tens of nm to several micron)
Processing Area□few mm ~ φ12"
Material●Silicon ●SUS ●Ni ●Fused Silica

Pillar

Range of Possible Features

φ30nm~
Height30nm~
Pitch60nm~
Pattern Area□several mm~φ300mm
ピラー
ピラー

Hole

Range of Possible Features

φ30nm~
Height30nm~
Pitch60nm~
Pattern Area□several mm~φ300mm
ホール
ホール

Line and Space

Range of Possible Features

φ30nm~
Height30nm~
Pitch60nm~
Pattern Area□several mm~φ300mm
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Four Types Mixed Pattern

Range of Possible Features

Two-Type and Four-Type mixed patterns (e.g. pillar/hole/L&S, etc.) are possible (same height for whole pattern).

Diameter and width100nm~
Height100nm~
Pitch200nm~
Pattern Area□10mm~50mm
ホール
4種混載

Blazed

ブレーズド
ブレーズド

Lens Array

レンズアレー
レンズアレー

Honeycomb

ハニカム

Square

スクエア

Moth-Eye

モスアイ

Large Area Molds

We provide large area mold for mass production.

We produce 12 inch diameter mold pattern boundary by using the most advanced semiconductor technology with high precision joints. We can fabricate high precision patterns on the entire surface of 12 inches.

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