Here is a brief overview of some of the challenges our nanoimprinting technology has actually solved.
If you have any questions or concerns about microfabrication in your company, please take a look at the following information.
In recent years, as the performance requirements of the latest mobile devices have become more sophisticated, semiconductor-level micromachining has been required for a variety of optical devices.
Most optical devices use a glass substrate as the base material, and many semiconductor devices, which are based on the conventional silicon substrate, are not capable of such processing.
In addition, depending on the device, only a few pieces of the device can be removed from a single substrate, making it impossible to achieve the required cost using technology with expensive semiconductor equipment.
Against this backdrop, we have received many inquiries from various manufacturers who are developing next-generation optical devices regarding ultra-fine processing on glass substrates. In addition, nanoimprinting technology is attracting a great deal of attention because it can be applied to large areas and is a low-cost processing technology.
In order to solve these problems, we have developed automated nanoimprinting equipment for φ8″ and φ12″ glass substrates, and have realized automatic nanoimprinting on glass substrates of various thicknesses.
As a result, our customers are pleased to see that we are able to provide microfabrication of various optical devices at a much lower cost than ever before.
Currently, this technology is being applied to the production of next-generation devices (AR, VR, HUD, 3D sensors, DNA sequencers, image sensors, etc.).
Recently, as mobile devices become thinner and thinner, there is a growing need to reduce the height of lenses stacked on top of each other in camera modules, for example, by forming optical elements such as micro lens arrays directly on the sensor device.
It is expected that the need for direct molding of optical patterns on CMOS and other sensors will increase in the future.
However, these sensor substrates, such as the CMOS substrate, are characterized by fine surface irregularities and low pressure resistance.
In contrast, conventional nano-imprinting cannot meet the requirements of conventional nano-imprinting because it is only possible to form patterns on a flat substrate of uniform thickness.
To solve this problem, we used our own uniform pressure molding technology to apply pressure evenly over the entire surface of the uneven substrate, thereby minimizing the load on the substrate. We have developed a unique process to control the load on the substrate to a minimum.
This process makes it possible to form patterns directly on top of various sensors, such as CMOS, which would have been difficult to process with conventional nano-imprinting technology.
In the future, this technology is expected to make a significant contribution to the thinning of various devices and the reduction of production costs in the field of image sensors and other areas.
In addition, this technology will make it possible to form fine patterns on curved surfaces, such as the surface of a lens.
In recent years, the realization of the dream of 5G for high-speed, high-capacity communication has become a reality.
For example, compound semiconductor substrates are used in laser devices, which are the key to 5G communications. These substrates are extremely fragile and can be damaged by even the slightest pressure.
For this reason, expensive processing technologies such as EB are now being used.
As the global shift to 5G continues, the demand for communication devices will increase significantly, requiring cost reductions and a significant increase in throughput.
Against this backdrop, our customers are looking forward to the mass production of laser devices using our nanoimprinting technology as an alternative to EB. As a result, our customers are looking forward to the mass production of laser devices using our nanoimprinting technology as an alternative to EB.
To address this issue, we have succeeded in controlling the load on the substrate to a minimum by using our unique uniform pressure molding technology. We have succeeded in minimizing the load on the substrate by using our unique equalizing pressure molding technology, and have made it possible to manufacture at a much lower cost than with conventional technologies.
By applying this technology, we have made it possible to form patterns directly on the surface of circuit boards, such as compound semiconductor boards, which are not subject to excessive force.
In next-generation optical devices that require advanced optical functions, such as augmented reality (AR) and head-up displays (HUD), which are said to replace smartphone displays in the future, inclined patterns, rather than vertical patterns, are being required.
It is possible to form a tilted pattern itself using semiconductor technology.
However, the high-angle FoV and other optical functions required in AR and HUD require a larger device. In addition, the processing cost must be low for widespread use.
On the other hand, the semiconductor process cannot meet manufacturing cost requirements because it is based on the premise of manufacturing small devices.
Therefore, nanoimprinting technology, which enables low-cost microfabrication, has been attracting attention.
With conventional nanoimprinting, however, it was possible to form patterns that were perpendicular to the substrate, but it was considered difficult to form inclined patterns.
In response to a customer’s request, we made it possible to form inclined patterns using nanoimprinting technology by optimizing the resin and, in particular, the mold release method.
By taking advantage of the large-area batch molding, a characteristic of our nanoimprinting technology, we were able to reduce costs.
It is expected to be used in various optical devices, mainly in the AR, VR, and HUD-related fields in the future.
Saiwai-ku, Kawasaki City,
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