Here briefly introduce the example of issues that our nanoimprint services could actually solve. Any concerns about microfabrication you might have, please refer to the below examples. Otherwise, we encourage to contact us !
Along with the advancement of optical elements, microfabrication at the level of semiconductor industry is required for various optical devices.
In most cases, glass substrates are used for optical devices.
Thus, generally semiconductor lithography process can’t be used for this purpose, because the process doesn’t want to process other substrates than glass.
Another issue was that when the utilization of the substrate isn’t good, the final device cost won’t be justifiable especially when semiconductor lithography process is used.
Company receives many inquiries about nano-fabrication from various optical device manufacturers that are developing next-generation optical systems. Because Scivax could demonstrate the large format (G5 size) nanoimprining in commercial scale, the technology has been greatly recognized as the low-cost manufacturing method.
We developed an automated imprinting tool for φ8″ and φ12″ glass wafers to take care of variety of thicknesses for various applications.
Our clients commented that nanoimprinting is the best candidate process for low cost mass production especially in high volume production stage.
Currently, the technology is being applied to the production of next-generation optical devices such as AR/VR, HUD, 3D sensors, Next Generation DNA sequencers, image sensors, etc.
Recently, as thinner and lighter is the general trend of mobile devices, there is an increasing demand to form optical parts such as micro lens, directly onto sensor device.
Such a need of forming optical structures directly on top of CMOS sensor device substrate is increasing.
However, those CMOS device wafer has an uneven surface and fragile.
And the ordinary imprinting tool worked pretty well on the flat substrate, but not for such special ones.
We invented the unique conformable imprinting technique to give the uniform pressure for entire area so that we could handle the uneven surface. And thanks to that invention, we could easily tweak the pressure to be able to handle the fragile substrate.
We now can handle the imprinting directly on the difficult surface like CMOS device wafer so that we can contribute to achieve the slim design with the significant cost benefit.
The same technique can also handle the imprinting on curved surfaces, such as lens.
Recently there is an increasing demand of the Hi-speed 5G network communication, while the adoption speed is slower than expected. There are multiple issues to solve, but the higher production cost of the key optical device, DFB (Distributed-feedback) Laser is that.
DFB Laser is the semiconductor laser which is composed of compound semiconductor substrates. And its structure is usually fragile to the mechanical stress, therefore people doesn’t believe Imprinting is suitable production process.
So far most of the people has been making DFB laser with EB (Electron Beam) lithography which is capable but suffered from the larger equipment investment and longer process time which resulted in higher device cost.
Clients contacted us with such dilemma to find the real mass production solution.
We collaborated with our clients to manage the breakage of the substrate to successfully form the nano-structure with our imprinting tool. The clients were happy with the results to be ready to larger volume production of the DFB laser device.
Thanks to our conformable imprinting technique, this was the good successful result to be able to contribute to the expansion of Hi-speed network.
The next-generation of optical devices such as AR (augmented reality) and HUD (head-up display) could potentially require a slanted structure to achieve the targeted form factor.
Slanted patterns can be made by semiconductor technology, but it’s only for the limited patterned area. On the other hand, the future AR and HUD is looking for the solution of wider FoV (Field of View). Essentially the patterned area has to be larger.
In this area, we need the master mold which has the slanted structure on the rigid substrate like Silicon first. The conventional nanoimprinting is good for vertical standing structure even with higher aspect ratio, but challenging for the tilted structure because it could damage the structure in removing the mold.
In response to consultation with clients, we worked hard to be able to demonstrate the slanted structure with the customers’ molds through optimizing the materials and processes. At this moment, Nanoimprinting is broadly acknowledged as one of the most promising mass production technologies for AR optics.
Our large-area imprinting can also provide the benefit to produce the middle size components like AR and HUD in terms of the production cost.
We expect the business expansion of the cutting edge device like AR, VR, HUD together with Nanoimprinting.
Saiwai-ku, Kawasaki City,