Nanoimprint Equipment

NIL Equipment | SCIVAX
Production NIL Equipment
Fully Automated UV Nanoimprint System
Dyad® 200
Developed by SCIVAX × Tazmo Co., Ltd.

A production UV imprint system jointly designed and developed with Tazmo Co., Ltd., a semiconductor manufacturing equipment manufacturer, integrating SCIVAX’s diverse imprint mechanisms into a single platform. The Hard-to-Hard imprint method, which uses a rigid substrate as the replica stamp base material, enables high-precision, high-yield mass production.

Dyad® 200 Fully Automated UV Nanoimprint System
Key Features
Challenges Solved by the Hard-to-Hard Method

Improved Uniformity for
AR Glass Waveguides

Compared with flex-substrate replicas, imprint distortion across the wafer is significantly reduced. Improved uniformity and image quality have been demonstrated in waveguide molding for AR glasses.

Overlay Alignment
≤±1μm

Achieves ≤±1μm with an optional alignment mechanism at mass-production level. Supports device manufacturing that requires precise pattern alignment.

Improved Release Performance for
High-Aspect-Ratio Structures

Mitigates replica damage that can occur during demolding of high-aspect-ratio structures such as pillar and hole shapes. Improves yield and productivity simultaneously.

Technology Comparison
Hard-to-Hard vs. Conventional (Flex Substrate)
Dyad® Method
Hard-to-Hard Imprint
Conventional Method
Flex-Substrate Replica
In-plane distortion is dramatically reduced
Distortion occurs due to the flex substrate
Improved uniformity and image quality for AR glasses applications
Yield loss due to image quality in AR glass applications
Reduced pillar breakage in high-aspect-ratio structures
High risk of structural damage during demolding
Mass-production-level overlay ≤±1μm
Difficult to maintain stable high-precision alignment
Standard NIL Tool（PET Soft Mold） vs SCIVAX Dyad®（Glass Replica Mold）
Distortion Comparison Image 1
Distortion Comparison
Distortion Comparison Image 2
Dyad® Hard-to-Hard Imprinting
Distortion Comparison Image 3
Yield Comparison
Measured data — Max distortion: Standard NIL tool 40pm/pitch → Dyad® 2pm/pitch (approx. 1/20)
System Configuration
System Modules
Spin coater ×2
Bake & cool plate
Vacuum bonding
Alignment (optional)
Imprint molding
Automatic demolding
Transfer robot ×3
Load port ×4

Load port breakdown: 2 for imprint substrates / 1 for master molds / 1 for replica molds

Specifications
Key Specifications
ItemDyad® 200
Molding methodUV nanoimprint (UV-LED λ=365nm)
Wafer handlingFOUP to FOUP
Work sizeΦ200mm (0.3mm ≤ t ≤ 1mm)
Mold sizeΦ200mm (0.3mm ≤ t ≤ 1mm) / Φ300mm (0.7mm)
Pressing force≤ 0.90MPa
Vacuum level≤ 50Pa
Demolding mechanismVertical demolding
Alignment accuracy≤ ±1μm (optional)
Throughput20 wafers/hour (process-dependent)
Overall dimensionsW5,460 × D2,560 × H2,500 (mm)

For the Dyad® 300 model compatible with Φ300mm wafers, please contact us separately.

Contact
Please feel free to request detailed materials or a quotation for Dyad®

Our representative will provide information on system specifications, implementation requirements, and quotations. Please feel free to contact us first.

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